Call Us Today: (925) 755-2300 | E-mail:
Applications & ProductsLaser Decapsulation & Failure AnalysisPlasma DecapsulationWet Chemistry DecapsulationReactive Ion EtchingPlasma Cleaning & Surface TreatmentPhoto Resist Stripping & Isotropic EtchingContact Angle & Substrate Surface ConditionsIR Vacuum Solder Reflow Ovens, Diamond Scribers, Fast Ramping Process FurnacesOther ServicesToll & Lab ServicesApplications
BSET EQ | Solutions Through Gas Plasma

With 15 years of plasma decap experience and 5 years of system development, we proudly present the BSET EQ Plaser

PLASER™ With Stand Feature

   Because of new package technologies, it has become more challenging for failure analysis teams to decapsulate today’s semiconductor devices. Often, plasma is the only way to meet your decapsulation needs.

   The BSET EQ Plaser is the world's only automated plasma decapper. The system has many advanced features that make it the system of choice for your plasma decapping needs…

  • Affordability
  • State of the art controller
  • “Next step” Fillerblast® technology
  • Progress monitor via camera
  • End point detection via image analysis
  • Precision automated stage with advanced controls
  • Proprietary plasma source
  • Switch between plasma sources for anisotropic etch
  • Plasma power ramping and tuner
  • Precision temperature control at stage
  • Data logging
  • Special vacuum configuration for pump protection



   The Plaser uses several advanced technologies to achieve the best results available today in plasma decap.

  • The part is held with all contact points at the same potential in a reusable fixture
  • The part is then placed on the automated process stage
  • The user presses start and the part is automatically delivered into the process chamber
  • After pumping down the chamber process gases are introduced into the chamber and the plasma process begins
  • Every 5-10 mins the chamber vents to the atmosphere and moves the device to the fillerblast zone where fillers are subsequently removed automatically.
  • After the filler removal routine the device is then moved to a camera where a picture is taken and delivered to the progress monitor screen.
  • If equipped with endpoint detection the image is analyzed for completeness.
  • If further processing is required the process is repeated
  • Typical process times from the top of the wire loops are 1 hour or less