NT Series metal vacuum chambers for plasma etching and cleaning for various industries worldwide

Unique Specifications

• Ability to perform in direct, R.I.E. and downstream plasma modes
• Stainless steel chamber for high process cleanliness and system integrity
• Proprietary

Capabilities

Applications

• 300mm wafer etching for reclaim
• BGA, Lead frames, C.O.B., Hybrids
• Plasma cleaning in all sectors of semiconductor packaging
• Enhancement of die attach, wire bonding and molding
• Optics
• PCB
• Flat panel etching and cleaning
• Solar Cell applications
• Wafer processing
• Wafer probe manufacture