NT Series vacuum chambers for plasma etching and cleaning for various industries worldwide

Unique Specifications

• Ability to perform in direct, R.I.E. and downstream plasma modes without tooling change overs
• Stainless steel chamber for high process cleanliness and system integrity
• State of the art process controller geared for process development
• Proprietary add ons & options
• Available in stand alone or table top

Features

• Stainless steel design provides chamber cleanliness only surpassed by quartz chambers
• All inert contruction eliminates possibility of contamination from the tool itself (no plastics or teflon)
• Each tool can be configured to operate in one or more of the standard plasma modes without modification (downstream, direct, or RIE mode)
• Achieves unsurpassed uniformity in both shelf to shelf device to device calculations
• Uniformity of our reactors allows us to maximize the number of working shelves in each tool
• High end no value reduced controller and high quality transducers monitor every important parameter for the process, providing a full diagnostic feedback
• Compatible with carriers for wafers, leadframes and substrates, connectors, etc.
• Available in 3 sizes to meet your throughput and power density needs

Applications

• 300mm wafer etching for reclaim
• BGA, Lead frames, C.O.B., Hybrids
• Plasma cleaning in all sectors of semiconductor packaging
• Enhancement of die attach, wire bonding and molding
• Optics
• PCB
• Flat panel etching and cleaning
• Solar Cell applications
• Wafer processing
• Wafer probe manufacture