Applications & ProductsPlasma Decapsulation & Failure AnalysisReactive Ion EtchingPlasma Cleaning & Surface TreatmentPhoto Resist Stripping & Isotropic EtchingContact Angle & Substrate Surface ConditionsIR Vacuum Solder Reflow Ovens, Diamond Scribers, Fast Ramping Process FurnacesParts Sourcing & Other ServicesLab ServicesApplications

Markets We Serve Semiconductor Applications Failure Analysis — Plasma decapsulation, Passivation & ILD Etch Packaging — Wire Bonding, Bump Adhesion, Die Attach, Pretreatment Cleaning Wafer Processing — Isotropic, Anistropic etch, Ashing and Descum Wafer Reclaim — Blanket Etcg, DLC Black Diamond Industrial Applications Surface Cleaning — Optics Bond Preparation — Automotive and Aerospace Connectors Solar, PV Applications Wafer Cleaning — Edge Etching, Ashing, Descum Surface Activation — Solar Cell Texturizing Hybrid Applications Surface Plasma Cleaning — Lead Frames, Wire Bonding, Die Attach Bond Preparation Biomedical Applications Surface Plasma Cleaning — Stent Cleaning, Wettability, Lubricity Bond Preparation Disk Drive Applications Polymide Etch — Read/Write Head Cleaning Photoresist Removal